{"id":308,"date":"2023-03-28T14:18:38","date_gmt":"2023-03-28T05:18:38","guid":{"rendered":"https:\/\/hkd.co.jp\/wordpress\/?page_id=308"},"modified":"2023-09-27T11:48:33","modified_gmt":"2023-09-27T02:48:33","slug":"oem_production","status":"publish","type":"page","link":"https:\/\/hkd.co.jp\/english\/oem\/oem_production\/","title":{"rendered":"Industrial science"},"content":{"rendered":"\n
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Packaging technology<\/a><\/p>\n\n\n\n

Process technology<\/a><\/p>\n\n\n\n

Mounting technology<\/a><\/p>\n\n\n\n

Evaluation technology<\/a><\/p>\n\n\n\n

Module\/unitization technology<\/a><\/p>\n\n\n\n

Process control<\/a><\/p>\n<\/div>\n\n\n\n

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Packaging technology<\/p>\n\n\n\n

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Die bonder<\/figcaption><\/figure>\n<\/div><\/div>\n\n\n\n
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Wire bonder<\/figcaption><\/figure>\n<\/div><\/div>\n\n\n\n
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How to finish the developed and designed sensor is an important core technology. We have accumulated technology to propose various assembly methods in consideration of the final usage situation. Various base materials such as lead frames, glass epoxy substrates, ceramics, and engineering plastics can be used. We have accumulated know-how on sensor protection that considers the usage environment, including molding. Our company work hard every day to provide stable quality.<\/p>\n\n\n\n

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to Top \u2191<\/a><\/p>\n<\/div><\/div>\n\n\n\n

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Process technology<\/strong><\/p>\n\n\n\n

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Dicing equipment<\/figcaption><\/figure>\n<\/div><\/div>\n\n\n\n
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Deposition equipment<\/figcaption><\/figure>\n<\/div><\/div>\n\n\n\n
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Exposure equipment<\/figcaption><\/figure>\n<\/div><\/div>\n<\/div>\n\n\n\n

It is an important core technology that creates the core of sensor functions. Applying thin-film and microfabrication technology, we have the technology to perform high-precision three-dimensional processing on silicon and glass substrates. This is the basic technology for developing and manufacturing compact, high-performance magnetic sensors and pressure sensors.<\/p>\n\n\n\n

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Mounting technology<\/strong><\/p>\n\n\n\n

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Surface mount equipment<\/figcaption><\/figure>\n<\/div><\/div>\n\n\n\n
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We are good at handling ceramic substrates and FPC substrates (flexible substrates) as well as component mounting on glass epoxy substrates.
We can handle a wide variety of mounting, from high-density mounting of 0603 chips, CSPs and other extremely small parts to BGA and large parts Max 120mm\u00c5~|xmm. And it is possible to mount the sensor chip (bare chip) on a die-bonded or wire-bonded substrate. (Conversely, it is also possible to die-bond or wire-bond the sensor chip to the mounted board.) With the latest washing equipment, it is possible to remove flux from narrow gaps such as the bottom of BGA and CSP parts.<\/p>\n\n\n\n

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Evaluation technology<\/strong><\/p>\n\n\n\n

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Magnetic characteristics inspection equipment<\/figcaption><\/figure>\n<\/div><\/div>\n\n\n\n
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Electrical characteristics inspection equipment<\/figcaption><\/figure>\n<\/div><\/div>\n\n\n\n
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Magnetization evaluation equipment<\/figcaption><\/figure>\n<\/div><\/div>\n\n\n\n
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Temperature evaluation equipment<\/figcaption><\/figure>\n<\/div><\/div>\n<\/div>\n\n\n\n

As our company that develops sensors, we understand what kind of quality is required for sensors. Considering what is necessary for the quality of the final product, we can develop our own inspection system. We maintain high quality by manufacturing inspection devices such as magnetism, pressure, and light sensors, and conducting inspections and measurements according to needs.<\/p>\n\n\n\n

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to Top \u2191<\/a><\/p>\n<\/div><\/div>\n\n\n\n

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Module\/unitization technology<\/strong><\/p>\n\n\n\n

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Temperature correction system<\/figcaption><\/figure>\n<\/div><\/div>\n\n\n\n
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Potting equipment<\/figcaption><\/figure>\n<\/div><\/div>\n\n\n\n
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Soldering robot<\/figcaption><\/figure>\n<\/div><\/div>\n<\/div>\n\n\n\n

Structures and circuits are necessary to bring out the characteristics of the sensor. Our unique know-how lies in knowing sensors well and adding advanced functionality to final products. We can quickly respond to diversifying needs from sensors to custom ICs, structure\/circuit design, and high-performance module manufacturing. In addition, we respond to requests with production technology that can flexibly respond to high-mix low-volume production. Environmental consideration is also an important technology.<\/p>\n\n\n\n

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Process control<\/strong><\/p>\n\n\n\n

With an integrated production system that integrates all processes from wafer processing, packaging, mounting, and modularization, we are able to respond flexibly to customer requests.
Production process managers plan and implement daily production instructions, quality checks, preventive maintenance of equipment, operator education (multi-skilled engineering), etc, and hey always think and work on the smooth execution of production plans and the improvement of operations.
In order to prevent process abnormalities, always pay attention to 4M (people, equipment, materials, methods) and try to improve yield.
At our company, employees who feel that something is different or a little strange write their realizations on a “something strange card” and submit it to prevent problems that may cause abnormalities. .
Cleanroom assembly is possible for products that are sensitive to dust and foreign matter.
In addition, for products that require ESD support, we can set a controlled area, manage temperature and humidity, install an ionizer, etc., and respond according to the required level.<\/p>\n\n\n\n

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